Equipotential bonding

Regardless of the PE connection, it is essential that low-impedance, HF-capable equipotential bonding is provided (see also EN 60204-1 or DIN VDE 0100-540):

  • Provide for a connection over a wide area between the device and the mounting plate.
  • To do so, use a ground strap (HF litz wire), for example, to connect the device and the grounding point of the system.
  • Do not use the cable shields of signal cables for equipotential bonding.

INFORMATION

For detailed information on equipotential bonding for decentralized inverters and drive units, refer to the publication "Drive Engineering – Practical Implementation, EMC in Drive Engineering" in chapter "Equipotential Bonding of Decentralized Inverters" by SEW‑EURODRIVE.

Ensure that there is a HF-capable equipotential bonding for all drive components. Use low-impedance, HF-capable connectors such as HF litz wire or ground straps. Standard protective earth conductors do not achieve sufficient equipotential bonding regarding HF and EMC.

[1]

HF litz wire, ground strap

[4]

Machine base

[2]

Product

[5]

Cable duct

[3]

Protective earth (PE)