MFC1.. design

The following figure shows a connection over a wide surface area between the mounting plate and the device:

[1]

Conductive connection over a wide surface between the device and the mounting plate, in case the entire contact surface is conductive (e.g. unpainted).

[2]

Second PE conductor via separate terminals (optional)

[3]

PE conductor in the supply system cable

[4]

EMC-compliant equipotential bonding, for example using a ground strap (HF litz wire). The contact surfaces must be conductive (free of paint).