Example
The following figure shows the connection options for the equipotential bonding via HF litz wire and FE conductor in the voltage supply:

[1] | The mechanical installation of a drive unit with hollow shaft does not create a conductive connection of drive unit and mounting plate. In this case, a low-impedance, Hf-capable equipotential bonding with HF litz wire is required. The mechanical installation of a drive unit without hollow shaft creates a conductive connection of drive unit and mounting plate. In this case, the entire contact surface must be electrically conductive (e.g. unpainted). |
[2] | FE conductor in the voltage supply. |
[3] | Alternative connection point for FE ground connection on the housing. |
[4] | FE ground connection on the housing, e.g. via ground strap (HF litz wire, no. 4) The contact surfaces must be electrically conductive (e.g. unpainted). For improved low-impedance grounding at high frequencies, SEW‑EURODRIVE recommends using corrosion-resistant connecting elements. Tighten the M5 screw with a tightening torque of 2.0 Nm – 2.5 Nm. |
- Do not use the cable shield of signal cables for the equipotential bonding.
INFORMATION
