Example

The following figure shows the connection options for the equipotential bonding via HF litz wire and FE conductor in the voltage supply:

[1]

The mechanical installation of a drive unit with hollow shaft does not create a conductive connection of drive unit and mounting plate. In this case, a low-impedance, Hf-capable equipotential bonding with HF litz wire is required. The mechanical installation of a drive unit without hollow shaft creates a conductive connection of drive unit and mounting plate. In this case, the entire contact surface must be electrically conductive (e.g. unpainted).

[2]

FE conductor in the voltage supply.

[3]

Alternative connection point for FE ground connection on the housing.

[4]

FE ground connection on the housing, e.g. via ground strap (HF litz wire, no. 4)

The contact surfaces must be electrically conductive (e.g. unpainted). For improved low-impedance grounding at high frequencies, SEW‑EURODRIVE recommends using corrosion-resistant connecting elements. Tighten the M5 screw with a tightening torque of 2.0 Nm – 2.5 Nm.

  • Do not use the cable shield of signal cables for the equipotential bonding.

INFORMATION

For detailed information on equipotential bonding for decentralized inverters and drive units, refer to the publication "Drive Engineering – Practical Implementation, EMC in Drive Engineering" in chapter "Equipotential Bonding of Decentralized Inverters" by SEW‑EURODRIVE.