Equipotential bonding of the MOVIONE® decentralized inverter

The following figure shows the connection of the equipotential bonding and the PE conductor:

[1]

Flat conductive connection between the MOVIONE® decentralized inverter and the mounting plate, provided that the entire contact surface is electrically conductive (e.g. not painted).

[2]

Second PE conductor via separate terminals

[3]

EMC-compliant equipotential bonding, e.g. via grounding strap (HF litz wire). The contact surfaces must be electrically conductive (e.g. unpainted).

[4]

PE conductor in the supply system cable

INFORMATION

For detailed information on equipotential bonding for decentralized inverters and drive units, refer to the manual "EMC in Drive Engineering – EMC-Compliant Installation in Practice" > "Equipotential Bonding of Decentralized Inverters" by SEW‑EURODRIVE.