Equipotential bonding of the MOVIONE^® drive unit

[1]

The mechanical installation of a drive unit with hollow shaft does not create a conductive connection of drive unit and mounting plate. In this case, a low-impedance, Hf-capable equipotential bonding [4] is required. If you install a drive unit without a hollow shaft, this results in a large, conductive connection between the drive unit and the mounting plate. In this case, the entire contact surface must be electrically conductive (e.g. unpainted).

[2]

PE conductor in the supply system cable

[3]

2. PE conductor via separate terminals

[4]

EMC-compliant equipotential bonding, e.g. via grounding strap (HF litz wire)

The contact surfaces must be electrically conductive (e.g. unpainted). For improved low-impedance grounding at high frequencies, SEW‑EURODRIVE recommends using corrosion-resistant connecting elements. The HF grounding option can be combined with LF grounding at the terminal box.