Cooling

• Make sure that the waste heat can be dissipated to the environment by means of heat convection.

You can ensure optimum heat convection as follows:

• Avoid heat sources in the immediate proximity of the device.
• In thermally critical installation situations, a fan can be used for additional cooling.

Observe the following for device variants with cold plate:

• The cold plate can reach a temperature of 85 °C without cooling. The device may only be operated in an installed condition with appropriate cooling.
• Ensure a good thermal connection between the cold plate and a thicker aluminum plate of the companion structure.

Observe the following for device variants with heat sink:

• The design with a heat sink allows the waste heat to be dissipated to the environment. This does not impair the degree of protection.
• Ensure that the heat sink is not located in a closed hollow space.
• Do not cover the heat sink.
• In mobile applications, align the heat sink with the airflow.
• As far as possible, install the device with the heat sink oriented vertically.