MMF32 design
The following figure shows the connection of the equipotential bonding and the PE conductor:
[1] | Conductive connection over a wide surface between the decentralized frequency inverter and the mounting plate, in case the entire contact surface is electrically conductive (e.g. unpainted). |
[2] | 2nd PE conductor via separate terminals |
[3] | PE conductor in the supply system cable |
[4] | EMC-compliant equipotential bonding, e.g. via grounding strap (HF litz wire). The contact surfaces must be electrically conductive (e.g. unpainted). |
INFORMATION
