Equipotential bonding

Regardless of the PE connection, it is essential that low-impedance, HF-capable equipotential bonding is provided (see also EN 60204-1 or DIN VDE 0100-540):

• Provide for a connection over a wide area between the device and the mounting plate.
• To do so, use a ground strap (HF litz wire), for example, to connect the device and the grounding point of the system.